Corporate Information
Renesas Mobile Corporate Information
| Name | Renesas Mobile Corporation |
| Headquarters | Nippon Building, 2-6-2, Ote-machi, Chiyoda-ku, Tokyo, Japan |
| Representative | Hideaki Chaki, CEO |
| Paid-in capital | 5 billion yen (Renesas Electronics Corporation 100%) |
| Capital | Start of operation: December 1st, 2010 |
| Employees | Approx. 1,900 (Consolidated, as of December 1, 2010) |
Renesas Mobile Business
Renesas Mobile offers advanced and innovative products and services for mobile phones, car infotainment solutions, consumer electronics and industrial applications.
Renesas Mobile's mission is to develop, productize and deliver advanced triple (2G/3G/4G) and dual-mode (2G/3G) communications centric semiconductor chipsets and platforms built on these chipsets to provide innovative solutions and drive new opportunities for our customers. Renesas Mobile will be the world leader in the mobile platform business by evolving our proven modem, application processor and SoC technology and associated services through our global business channel.
The Renesas Mobile Modem team has developed over 6 generations of WCDMA chipsets, and even more GSM chipsets generations, over 15 years. Cumulatively there are over 2 Billion handsets sold based on the modem technology now owned by Renesas Mobile. This modem technology has been proven on all the major infrastructure vendors and is used by over 200 Operators worldwide.
To maintain the quality of our product we run continuously 2-3 IODT (to validate advanced features) sessions each week with other industry players as well as perform continual regression testing of the existing 2G/3G/Dual System functionality in live commercial 3GPP networks. Modems using the same technology are in over 30% of the world’s handsets (Strategy Analytics, RF and Wireless Component Service Baseband Quarterly Tracker, Dec 2010) making Renesas Mobile the premier and most pervasive modem technology supplier.
Renesas Mobile Product Family
Our main products are described below:
Application processors:
Worlds’ leading APE provider with stunning hardware accelerated 3D, HD graphics capability on multi-core ARM processors giving customers unrivalled performance combined with world leading area and power implementations.
Modem Chipsets and Slim Modem Platforms:
Stand-alone LTE triple-mode and dual-mode modem solutions for M2M, data-cards, high performance smartphones and leading edge web tablets. Available as complete GCF certified reference platforms with world class support to reduce time to market.
Integrated Communications Processors:
Combining and integrating the world’s leading modem technology with an embedded high-performance APE supporting all leading OS’s allowing customers to create smartphones to penetrate new markets and price points.
Mobile platforms:
Complete baseband engines with OS base port to accelerate handset development times. All offered with flexible, second to none service and expertise.